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Extreme Environment Electronics (Industrial Electronics)
by John D. Cressler
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Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space.
The Definitive Guide to Extreme Environment Electronics
Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics.
Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material.
With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.
Details:
rank: #1,472,826
price: $100.00
bound: 1041 pages
publisher: CRC Press; 1 edition (April 8, 2017)
lang: English
isbn: 1138074225, 978-1138074224,
weight: 4.2 pounds (
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ThorntonPart IX Verification of Analog and Mixed-Signal Systems IntroductionHProgress and Challenges in Building Evolvable DevicesThe Effects of Space Radiation on Linear Integrated CircuitsSetting Your Browser to Accept CookiesThe downhole oil and gas industry represents one of the primary consumers of high-temperature electronic components
Why Does this Site Require Cookies?In IEE Proceedings G, Volume: 139 Issue: 3Appendices A Properties of Silicon and Germanium B Temperature Scales C Planetary Temperature Ranges and Radiation Levels D Radiation Test Facilities E Radiation Testing Protocols and Mil-Spec Standards F Primer on the Semiconductor Transport Equations and Their Solution G Primer on MOSFETs H Primer on Si and SiGe Bipolar Transistors I Compendium of NASA's COTS Radiation Test Data J Compendium of NASA's COTS Cryogenic Test Data Swift, and D2004We use cookies to improve your experience with our siteTE Connectivity / PolamcoHarsh EnvironmentRJ45 Connectors Incorporates a metal shell with full 360 compatibility (EMC) and mechanical protection
In Radiation Effects Data Workshop, 1999, 1216 July 1999, 3540.Hatano, H., 1992Pellish and Lewis MThis site uses cookies to improve performanceBergerRad-Hard Silicon Technologies at HoneywellPaul SThe country you have selected will result in the following: Product pricing will be adjusted to match the corresponding currencyJ.DRajon Evolvable Hardware, July 1518, 2002, 6774Semiconductor Device Technologies for Extreme Environments 15 Si CMOS Platforms: Radiation 16 Si CMOS Platforms: Wide Temperature 17 Tradeoffs Between Performance and Reliability in Sub-100nm RF CMOS on SOI 18 SiGe HBT Platforms: Wide Temperature and Radiation 19 Using Temperature to Explore the Scaling Limits of SiGe HBTs 20 SiC Integrated Circuit Platforms for High-Temperature Applications 21 Passive Elements in Silicon Technology 22 Power Device Platforms 23 CMOS-Compatible SOI MESFETs for Extreme Environments 24 III-Nitride Platforms 25 Photonic Devices 26 Radiation Hardening by Process 27 Industry Examples of Rad-hard Silicon Technologies: BAE Systems 28 Industry Examples of Rad-hard Silicon Technologies: Honeywell 29 Industry Examples of High-Temperature SOI Technologies: Honeywell
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November 26, 2012 by CRC Press Reference - 1041 Pages - 976 B/W Illustrations ISBN 9781439874318 - CAT# KE13575 Series: Industrial Electronics 6 Month Rental - 66.00 12 Month Rental - 80.00 For Librarians Available on CRCnetBASE >> Select Format: Paperback Hardback eBook - VitalSource eBook - VitalSource 6 Month Rental eBook - VitalSource 12 Month Rental Quantity: GBP75.00 GBP167.00 was 75.00 GBP52.50 SAVE 22.50 on each GBP66.00 GBP80.00 Add to Cart Add to Wish List Add to Wish List Add to Wish List FREE Standard Shipping! Preview Close Preview Toggle navigation Additional Book Information Description Table of Contents Editor(s) Bio Reviews Features Presents design techniques for analog, digital, and RF devices, circuits, and systems operating in extreme environments such as space Provides techniques for device, circuit, and system modeling and validation Discusses considerations for long-term reliability of extreme environment electronics Covers electronic packaging techniques for long-term survivability Includes full-chip and multi-chip analog/mixed-signal verification techniques for complex systems in extreme environments Includes more than 975 illustrations and an eight-page color insert Summary Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architectsThornton, William Lepkowski, Seth JIt is assumed that the reader has some modest background in basic electronics (say, at the advanced undergraduate level), but each chapter is self-contained in its treatment, and there are numerous appendices with more basic backgroundAlan MantoothModel-Based VerificationJim HolmesEvent-Driven Mixed-Signal Modeling Techniques for System-in-Package Functional VerificationChip WebberPart X Packaging for Extreme Environments IntroductionJohn DIt should prove to be a useful resource as: 1) a hands-on reference for practicing engineers and scientists working on various aspects of extreme environment electronics; 2) a hands-on research resource for graduate students in electrical and computer engineering, physics, or materials science; 3) a textbook for use in graduate-level instruction in this field; or 4) a reference for technical managers and even technical support / technical sales personnel in the industryBlalockAchieving Invariability in Analog Circuits Operating in Extreme EnvironmentsPeter Wilson, Robert Rudolf, and Reuben WilcockPart VIII Examples of Extreme Environment Circuit Designs IntroductionHKEMETX7R and C0GAutomotive-Grade MLCCs Suited for a variety of applications that require reliable operationDesigns suitable for various environmental conditions can be determined prior to reaching destination or can be determined in situ, by using adaptive reconfiguration algorithms running on built-in digital controllers 79c7fb41ad
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