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Current–pressure characteristics of dc magnetron discharge for high-rate sputtering. A O Serov1,2, Yu A Mankelevich1, A F Pal1,2 and A N Ryabinkin1,2. 1 Skobeltsyn Institute for Nuclear Physics of the Lomonosov Moscow State University,. Leninskiye Gory 1, Moscow 119899, Russia. 2 State Research Center of the
16 Sep 2011 Thin Film Growth Through Sputtering. Technique and Its Applications. Edgar Alfonso, Jairo Olaya and Gloria Cubillos. Universidad Nacional de Colombia. Colombia. 1. Introduction. During the last decade the dc and rf sputtering techniques have been used extensively in their two configurations
But the most widely reported techniques in the literature and most widely used in industry are DC/RF magnetron sputtering, pulsed laser deposition and spray pyrolysis. Extract details about the various thin film preparation techniques are given by Maisel and Glang[7] and Chopra[8]. In this study, MIO films were produced by
17 Oct 2005 Varieties of sputtering experience. D.C. sputter deposition: Only for conducting materials. if DC sputtering were used for insulator. e.g. carbon, charge would accumulate at each electrode and quench plasma within 1 - 10 mico-sec. + Ar+ cathode anode. ?. V ? 1 kV. -. C. Ar. C t < 1 micro sec. C. Ar =Ar+ + e-.
DC Sputtering. • Initially pump system down to. 10-6 – 10-7 Torr for purity. • Then let in controlled amount of the gas to be ionized (generally. Argon). • Eventually the chamber pressure will be around 1 – 100. mTorr. – This number is determined by the pressure required to have a sustainable plasma given the chamber
2 Aug 2012 or DC sputtering. ion-beam sputtering, reactive sput- tering - but all these are variants of the same physi- cal phenomenon. Sputtering is the process whereby atoms or molecules of a material are ejected from a target by the bombardment of high-energy particles. More significantly. cathodic sputtering is the
Reactive Sputtering. The goal: To produce a compound film from an ELEMENTAL target (i.e. Al. 2. O. 3. , TiN). Advantages: ?Controlled stoichiometry at high deposition rates. ?Elemental targets can be very pure and easy to produce and bond. ?Target material metallic, easy to cool, more power can be applied.
16 May 2013 DC Sputtering (Cont.) www.glue.umd.edu/~ddev/me489f/slides/2b_deposition_x6.pdf. Light e- pulled towards walls faster than ions, leaving slightly more ions in glow region. Light e- move away from cathode faster than ions, leading to a large field, high acceleration of ions into cathode high-E ions
Instead of using heat to eject material from a source, we can bombard them with high speed particles. • The momentum transfer from the particles to the surface atoms can impart enough energy to allow the surface atoms to escape. • Once ejected, these atoms (or molecules) can travel to a substrate and deposit as a film.
behavior of the deposition parameters as a function of the reactive gas flow. To model this behavior, the fluxes of the various species towards the target must be determined. However, equally important are the fluxes of species incident at the substrate because they not only influence the reactive sputter deposition process
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