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eutectic die attach equipment
17 Sep 2015
The flexible FINEPLACER® lambda is a sub-micron die-bonder for precision die attach and advanced chip packaging. It offers a modular design and can be
T-4909 Budget sensitive Manual Die Bonder. The T-4909 is a manual, high quality die bonder with superior ergonomic design. As with all of Tresky's products,
The world's leading Manual X-Y-Z Micromanipulator (Look at the moving hand - then look at the tool also). "C" Series. 7200CR Dual Head Epoxy Die Bonder
The FINEPLACER® matrix ma is a semi-automatic bonder representing the latest development from Finetech. Encompassing the “Built to be Best" philosophy,
Die bonding (often referred to as die attach) is the process of attaching a die/chip to a Hybond's UDB-140A semi-automatic and UDB-206 manual eutectic die
simple manual operation, chips placed from waffle pack on adhesive dispensed in a separate step. Recommended machines: 5380
27 Sep 2012
The T-4909 Low Cost Manual Die Bonder is a high quality die bonding system with The T-4909 manual semiconductor die bonder is suitable for die attach of:.
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