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Suss ma6 mask aligner manuals: >> http://dli.cloudz.pw/download?file=suss+ma6+mask+aligner+manuals << (Download)
Suss ma6 mask aligner manuals: >> http://dli.cloudz.pw/read?file=suss+ma6+mask+aligner+manuals << (Read Online)
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Karl Suss MA6 SOP. Rev 10 - 01/24/2017. Page 1 of 11. Karl Suss MA6 Mask Aligner. SOP. Safety. •. UV Exposure: The high energy light produced by the high pressure. Mercury Xenon lamp can cause Description. The Karl Suss MA-6 Contact Aligner system can perform precision mask- . contact Staff for instructions.
The MJB4 Mask Aligner from SUSS MicroTec is the perfect system for research institutes, universities and small volume production. Easy to use and compact in size, the SUSS MJB4 has set industry standards specifically for pro- cessing of small wafers/substrates or pieces and offers an ideal and cost-effective solution.
Manual Mask and Bond Aligner. The MA/BA6 mask and bond aligner is designed for up 150 mm wafer size. The MA/BA6 is used for MEMS applications, production of optical components and compound semiconductors. It is very convincing through its multifaceted field of applications in research and development
The SUSS MA6 Mask Aligner is designed for high resolution photolithography in a laboratory for devel- opment, small volume production or pilot production environment. It offers unsurpassed flexibility in the handling of ir- regularly shaped substrates of varying thickness, as well as standard size wafers up to 150 mm in
1.0 Karl Suss MA6 Mask Aligner. Figure 1: MA6 Mask Aligner. 1.1 Introduction. The Karl Suss MA6 is a top and bottom side contact lithography printer used for fine line lithography down to 1 micron or better. It is capable of processing 4-inch substrate. After reading this manual, the User should be able to describe a typical
Suss MA6 Mask Aligner User Manual. Version of 2016-07-04. Get the latest one at cmi.epfl.ch/photo/files/MA6/MA6.std.manual.pdf. 1. Introduction. This user manual explains how to operate the. Suss MA6 mask-aligner in standard. “photolithography" mode. Default illumination setup on MA6: Intensity = 20mW/cm2,
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The tool can be equipped with either a SUSS. Singlefield or a Splitfield microscope enabling fast and highly accurate alignment. MJB4. MASK ALIGNER. Features and Benefits s High resolution printing down to. 0.5 µm. s Wafer and substrate handling up to dia. 100 mm (wafers), 4"x4" (substrates) s Special substrate chucks
Suss MA6#1 Mask Aligner is classified as a “Non-Standard" equipment;. Suss MA6#2 Mask Aligner is classified as a “Clean/Semi-Clean". 2.2 Substrate Size: TSA is >5mm. 2 to 2", or 4"; BSA is 2" or 4". 2.3 Photo mask Size: 5" Square. 2.4 Alignment Accuracy: TSA (down to 0.5um), BSA (down to 1um). 2.5 Resolution: 1um
Operating instructions for MA6 mask aligner. Start procedure: 1. Check whether the lamp is on. If not, please talk to Mikhail Gaevski, Pat Watson or Joe. Palmer. Incorrect procedures to light the lamp might cause the explosion of the lamp. 2. If the mask aligner is turned off for any reason, turn on the TV monitor before you turn
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